260305_Wang_J_001

Jun Wang, Assistant Professor in Electrical and Computer Engineering, holds two variants of the nove
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260305_Wang_J_001
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Jun Wang, Assistant Professor in Electrical and Computer Engineering, holds two variants of the novel 10 kV SiC MetaPak switch cells inside his lab in the Scott Engineering Center. MetaPak is a fail-safe SiC device packaging platform designed to enable next-generation, high-frequency, ultra-resilient energy infrastructure and was previously sponsored by ARPA-E IGNIITE. In the new ARPA-E VisionOPEN program, Wang will develop another novel packaging platform called LincolnPak. March 5, 2026. Photo by Jordan Opp / University Communication and Marketing.